
Intel CPU LGA 4189 Vapor Chamber Heat Sink
Heat sink type:CPU heat sink;
Components:Vapor chamber+aluminum zipper fin+aluminum base;
Application:Intel Icelake platform.
Product Introduction
Intel CPU LGA 4189 vapor chamber heat sink is designed for Intel IceLake and Copper Lake Server processor. With the development and integration of the server CPU is increasing, so the heat flux density is much higher, to keep the Server CPU working under the secure environment, an appropriate thermal solution is critical, the traditional single metal heat sink could not meet the thermal requirements, so we need to utilize some special thermal elements to improve the thermal conductivity and heat dissipation performance to remove the heat from the CPU in time. So Sinda Themral designed the Intel CPU LGA 4189 vapor chamber heat sink accordingly.
Product specification
| Material | Aluminum zipper fin+aluminum base+vapor chamber | Manufacturing process | Stamping+CNC+soldering |
| CPU cooler dimensions | 113mm*78mm*25mm | Surface finish | Chemical nickel plating, copper wash |
| CPU type | LGA4189 | Package | Tray+Carton |
| Fin thickness | 0.3mm or custom | Rohs/CE | Yes |
| Fin pitch | 1.8mm or custom | OEM/ODM | Yes |
| CPU TDP | 230W | Application | IceLake,Copper Lake platform |
Product details

Vapor chamber
Vapor chamber is manufactured by sealing copper plates and filling some fluid such as de-ionized water, the working principle is similar to heat pipe, but it can spread the heat to many directions, so the vapor chamber can spread and transfer the heat rapidly from the CPU. Vapor chamber is one fo the best thermal solutions as the base of a heat sink, it's typically used for high power applications. Vapor chamber is composed of a sealed vaccum vessel which is made by welding two copper plates, an internal capillary structure which is made of sinter copper powder or wich copper mesh, and some working fluid, usually is water as it has high latent heat, high surface tension, high thermal conductivity and suitable boiling temperature, not to mention the cost and environmental concerns.

Aluminum zipper fin
Due to the great heat dissipation performance and cost efficiency, aluminum zipper fin is the most widely used in high power thermal modules. aluminum zipper fin is manufactured by stamping the aluminum sheets from a tooling die, which can make the quite thin fins and high fin density to create more heat dissipation area to improve the thermal performance. The function of aluminum fins is to dissipate the heat transferred from the CPU, so it's often combined with heat pipes or vapor chambers, to solder with other thermal components, the surface finish of aluminum zipper fin is chemical nickel plating.
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Why choose us
Sinda Thermal is a leading heat sink manufacturer and our factory has been founded over 8 years, our engineering team consists of many thermal experts, we already provided varieties of thermal solutions for the customers in the world. Our factory owns many precise machines and equipment to manufacture high quality products. Currently our factory has 100 employees, so we have the enough capacity for the global customers. Sinda Thermal has been devoted in heat sink design, manufacturing for 8 years, which enables us to be a professional and experienced heat sink supplier, If you have any thermal requirements, please contact us freely.
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