Industrial Fulian Joins With Intel To Release New Generation Advanced Cooling Technology

    Recently, Industrial Fulian and Intel jointly released the next generation of advanced cooling technology, aiming to break through the current limits of liquid cooling technology and provide advanced cooling solutions for the growing demand for AI computing power. This technology was jointly developed by Industrial Fulian and Intel, and has completed the design, development and test verification of progressiveness cooling system. According to experimental data, the use of superfluid liquid cooling technology can meet the heat dissipation requirements of over 800W TDP. System optimization and radiator design are further improved to achieve the heat dissipation target of 1500W TDP.

  Industrial Fulian introduced that the company is actively exploring cutting-edge technologies in the field of liquid cooling. Previously, it independently developed the world's smallest fourth generation Xeon high-performance processor computing module, which achieved high-density and high computing power deployment through modular design, meeting computing power requirements from the cloud to the edge, and achieving energy conservation and carbon reduction.

 

Integrated liquid Cooling Unit

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