Intel Promotes Multiple Innovative Technologies To Cool Next-generation Chips With Power Up To 2000W

    According to Intel's official website, Intel researchers are exploring novel solutions to cool next-generation chips with power up to 2000W. Intel stated that it will address the hot challenges of the next generation of chips through "new materials and structural innovations". These solutions cover improvements from 3D vapor chamber  heatsink and jet liquid cooling, as well as optimization designs related to immersion cooling.

   Intel stated that as multi-chip modules become increasingly difficult to cool, this technology can be customized for each structure, effectively targeting hotspot cooling, enabling processors to operate at lower temperatures and improve performance by 5% to 7% at the same power.