Micro Stamping Heatsink Is Ready For Mass Production

       Today,  Sinda Thermal team finish the hard tooling process for the  micro stamping heatsink.  The heatsink material is aluminum with black anodized surface treatment.  We will send some hard tooling samples to customer for approval , then we  can start the mass production process, thanks again for choosing Sinda Thermal.

   Micro thin stamping cooling heatsink is a product specializing in low-power device cooling applications. It has high-strength pressure-sensitive thermal conductive adhesive, which can be easily adhered to the device (or heat source).This design provides an effective method for cooling IC devices with high cost effective, which is suitable for those occasions where the space of electronic products is limited and the traditional radiator cannot be used, so it improves the long-term reliability of the devices.