Rapid Thermoforming Ceramics Are Expected To Be Used For Heat Dissipation in Electronic Products

     In July 2021, researchers were testing an experimental ceramic compound. When subjected to extreme thermal change and mechanical pressure, ceramics are prone to fracture or even explosion due to thermal shock. When using a blowtorch to spray ceramic, it deforms. After several experiments, the researchers realized that they could control its deformation. So they began to compress and shape ceramic materials and found that this process was very fast.
    The underlying microstructure allows for rapid heat transfer and effective flow of heat throughout the entire ceramic molding process. Researchers suggest that this ceramic can form exquisite geometric shapes and exhibit excellent mechanical strength and thermal conductivity at room temperature. This type of thermoformed ceramic is a new field of materials.