Aluminum Zipper Fin And copper Plate Soldering Heat sink
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Aluminum Zipper Fin And copper Plate Soldering Heat sink

Aluminum Zipper Fin And copper Plate Soldering Heat sink

Soldering heat sink is manufactured by combining the fins and base together to the reflow oven to get a heat sink assembly, as the extrusion technology has the fin density and thickness limitation, the soldering heat sink assembly can solve this issue to improve the thermal performance. The fins can be aluminum zipper fins, folded fins and L-fins, the thickness of the fins can reach 0.2mm and has little fin density limit which means the heat sink has more surface area to dissipate the heat to the air.

Product Introduction

     As the electronics and other industries are developing, heat sinks play a vital role in managing the temperature for the devices. A heat sink works by dissipating heat from electronic components so that the device can operate at a safe temperature. Heat sinks usually consist of aluminum fins attached to a base plate. However, in order to ensure efficient heat transfer, aluminum fins usually be welded with copper plates. 

 

Why use copper plate

  Copper is an excellent conductor of heat, which makes it an ideal material to conduct the heat source. Copper has high thermal conductivity, which means it transfers heat quickly. so using a copper plate instead of an aluminum plate as the base material can improve the thermal conductivity of the heat sink.

 

Improved Thermal Performance

  Soldering aluminum fins with copper plates can significantly improve the thermal performance of the heat sink. A copper plate has a higher thermal conductivity than an aluminum plate, which means it can rapidly absorb the heat from electronic and transfer it to the aluminum fins quickly. This improves the overall thermal performance of the heat sink, which can reduce the operating temperature of electronic components.

  Soldering heat sink is manufactured by combining the fins and base together to the reflow oven to get a heat sink assembly, as the extrusion technology has the fin density and thickness limitation, the soldering heat sink assembly can solve this issue to improve the thermal performance. The fins can be aluminum zipper fins, folded fins and L-fins, the thickness of the fins can reach 0.2mm and has little fin density limit which means the heat sink has more surface area to dissipate the heat to the air.

 

The Process of aluminum zipper fin base heat sink

Aluminum zipper fins: Stamping the aluminum sheet through the tooling die by high stamping machine to get a zipper fin assembly as designed, then do the nickel plating;

Copper base: Machining the shape and dimension by CNC machines;

Soldering process: Assemble the aluminum zipper fins with copper plate to the fixture tooling and put them to the reflow oven for soldering

 

 

Varieties of heat sink

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink


Thermal simulation

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink


Factory and workshop

 

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink


Certificates

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink

Intel LGA1700 Aluminum Fin Heat Pipe Air Cooling CPU Heatsink

 

 

  Sinda Thermal is very experienced in manufacturing the soldering type heat sink, we have over 30 sets high speed stamping machines to produce the zipper fins, and over 30 sets precise CNC machines to manufacture the the aluminum base, 2 reflow soldering lines to manufacture the heat sink assemblies. Aslo we have several professional thermal testing device to simulate the thermal results before the heat sinks shipping to customer. We can manufacture the high quality and competitive price aluminum zipper fin base heat sink as we are a excellent heat sink manufacturer with over 7 years thermal experiences.

 

FAQ
1. Q: Are you a trading company or manufacturer?
    A: We are a leading heat sink manufacturer, our factory has been founded over 8 years, we are professional and experienced.

2. Q: Can you provide OEM/ODM service?
    A: Yes, OEM/ODM are available.

3. Q: Do you have MOQ limit?
    A: No, we don't set up MOQ, prototype samples are available.

4. Q: What's the lead time of the production?
    A: For prototype samples, the lead time is 1-2 weeks, for mass production, the lead time is 4-6 weeks.

5. Q: Can I visit your factory?
    A: Yes, Welcome to Sinda Thermal.

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