Samsung Is Exploring The Next Generation Of Semiconductor Immersion Cooling Solutions

    Samsung Electronics recently attended an international electronic packaging seminar held in Busan, introducing the "immersion cooling" solution. As semiconductor miniaturization reaches its physical limit, people's interest in packaging technologies to improve chip performance is increasing day by day. How to control the heat generation of semiconductors has become a challenge for chip and mobile phone manufacturers. Samsung's proposed immersive cooling can significantly reduce heat dissipation power consumption compared to existing air cooling.
    Samsung admits that the initial investment cost of this solution is very high, and it has high stability and semi permanence, so it has advantages in many aspects.