TCL Technology Applies For Composite Material Patents

   Recently, according to the announcement of the China National Intellectual Property Administration, TCL Technology Group Co., Ltd. applied for a project entitled "Composite Materials, Thin Films, Optoelectronic Devices and Their Preparation Methods"
The patent abstract shows that the present application discloses a composite material, thin film, optoelectronic device and its preparation method. The composite material includes a hole functional material and a thermal conductivity material with a thermal conductivity coefficient of 0.2-5500W/(m · K). By adding a thermal conductivity material with a thermal conductivity coefficient of 0.2-5500W/(m · K) to the composite material, the thermal conductivity of the composite material can be increased, and the characteristics of good hole function can be maintained, It has good application prospects.