The AI Chip Packaging Material Market Is Expected To Reach 29.8 Billion RMB By 2027

    With the advancement of AI technology, high heat dissipation demand is driving the growth of the packaging material market, and it is expected that the market size will reach 29.8 billion yuan by 2027. The cost of packaging materials accounts for 40% to 60%, and the upgrade of solid crystal adhesive to solid crystal adhesive film improves uniformity and performance, saving costs. The bottom filling material market is expected to grow to $1.58 billion by 2030.