The New Active Cooling Chip Solution Is Expected To Surpass Fan Cooling

   Recently, startup Frore Systems announced that laptops equipped with its AirJet active cooling chip solution will debut early this year, bringing new active cooling solutions in addition to air and water cooling. It is reported that the company's AirJet active heat dissipation chip can achieve equivalent heat dissipation effect to traditional fan heat dissipation while only producing about 24 to 29 decibels of noise.

   This type of chip adopts a "solid-state heat dissipation solution", with tiny membranes inside the chip that generate strong airflow, which enters the chip through the top vent and takes away heat from a separate vent. Compared to fan cooling, this technology not only has lower noise, but also has a thickness of only 2.8mm, which can effectively reduce the thickness and noise of laptops. At present, this technology has received support and recommendation from mainstream manufacturers such as Intel and Qualcomm, and Intel also plans to use the AirJet chip in future Evo standard laptops.