Thermal Test For Copper Vapor Chamber Heatsink Just Finished

   Last week, we received an sample order demand of 50pcs copper vapor chamber heatsink for telecom device application from Austria customer. This is pure copper material which can support 400W TDP, wejust finished the themral performance test in our factory, we will finish the final packing and ship to customer site soon. 

    Vapor Chambers leverage high heat transport capabilities of two phase cooling in a planar format. This makes Vapor Chamber Assemblies ideal components when spreading high heat densities or heat loads across a larger surface. By using Vapor Chambers, you can expect increased and more uniform heat spreading, which is ideal when optimizing heat sink performance.