Vapor Chamber Heatsink
The vapor chamber is a vacuum chamber with a micro structure on the inner wall, usually made of copper. When the heat is transferred from the heat source to the evaporation zone, the cooling liquid in the cavity begins to vaporize after being heated in a low vacuum environment. At this time, it absorbs heat and expands rapidly, and the cooling medium in the gas phase quickly fills the whole In the cavity, when the gas phase working fluid comes into contact with a relatively cold area, it will condense. Through the phenomenon of condensation, the heat accumulated during evaporation is released, and the condensed cooling liquid will return to the evaporation heat source through the capillary channel of the micro structure, and this operation will be repeated in the cavity.
Product Introduction
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With the development of electronic and electrical technology and the improvement of user needs, various electronic products in daily life, scientific research, science and education have more and more functions and higher power, and the thermal issue of electronic products is becoming more and more serious. Vapor chamber (vc) is an ideal solution to solve the thermal problems of various electronic products.
Vapor chambers have been widely used in the field of electronic equipment to solve the high power thermal issues. The isothermal plate utilizes the phase change process of the working medium to achieve effective heat transfer by absorbing and releasing latent heat. And it effectively dissipates heat with high-temperature "hot spots" and flattens it into a relatively uniform temperature field. How to make smaller, thinner and larger heat transfer temperature chambers is of great significance to the thermal field electronic equipment.
Size: There is no limit in theory, but the VC used for electronic equipment cooling rarely exceeds 300-400mm in the X and Y directions. Thickness is a function of capillary structure and dissipated power. Sintered metal core is the most common type, the VC thickness is between 2.5-4.0mm, and the minimum ultra-thin VC can be between 0.3-1.0mm.
Power density: The ideal application of VC is that the power density of the heat source is greater than 20W/cm², but in practice many devices exceed 300W/cm².
Protection: The most common coating used for heat pipes and VCs is nickel plating for corrosion protection and aesthetics.
Operating Temperature: While VCs can withstand multiple freeze/thaw cycles, their typical operating temperature range is between 1-100°C.
Pressure: VCs are typically designed to withstand 60psi of pressure prior to deformation, up to 90psi.
Product information
| Dimension | 81.5*57.5*5.95mm or customized |
| Material | C1020 |
| Power | 100W |
| surface finish | nickel plated or customized |
| Certification | Rohs, CE |
| Lead time | Based on the quantity |
The advantages of vapor chamber
Compared with heat pipe, vapor chamber has a better temperature uniformity, heat pipe is usually used to transfer the heat, but vapor chamber can spread the heat and can cool down the heat source rapidly
Also when the thermal buget is tight, the vapor chamber heat sink would be a better choice.
How to design a vapor chamber
Juse like heat pipes, the thermal conductivity of VC increases with length. This means that the VC with the same size as the heat source has almost no advantage over the copper substrate. A rule of thumb is that the area of VC should be equal to or greater than ten times the area of the heat source. In the case of large Thermal Budget or large air volume, this may not be a problem. However, in general, the basic bottom surface needs to be much larger than the heat source. VC should be at least 10 times the size of the heat source.
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