TSMC Announces Immersion Cooling Design

   TSMC stated at its annual technology seminar that the power consumption of each chip and rack unit in the computing field will not be limited by traditional air cooling. When the chip packaging power exceeds 1000W, the data center needs to prepare an immersive liquid cooling system for AI or HPC processors, resulting in the need for a thorough restructuring of the data center structure. TSMC revealed in 2021 that it had attempted on-chip water cooling solutions and even said it could meet the 2.6kW SiP heat dissipation demand.
   Although this technology faces short-term and sustained challenges, tech giants such as Intel are quite optimistic about immersive liquid cooling solutions and hope to push the technology into the mainstream.