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24
Nov, 2023
Intel 4 Nm Technology Places More Emphasis On Energy Efficiency Than Intel 7 ...In a collective interview held in Penang, Malaysia on the 22nd local time, William Grimm, Vice President of Intel Logic Development, stated that the yield of the Intel 4nm process was higher than e...
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23
Nov, 2023
Asus Launches Its First 360mm Large Liquid -Cooled HeatsinkRecently, ASUS announced the launch of the new TUF Gaming LC II 360 ARGB liquid-cooled radiator, providing gaming players and high-performance computing users with superior cooling performance and ...
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23
Nov, 2023
TSMC Continuously Develop New Technologies To Meet AI Cooling NeedsAccording to reports, TSMC is intensifying cooperation with multiple hardware manufacturers to address the issue of excessive heat dissipation needs for AI chips and servers. Faced with the rapid g...
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22
Nov, 2023
Ice Giant Thermosiphon Radiator Ready For SaleIn the past two years, IceGiant has had a very attractive heatsink called ProSiphon Elite, which was released in 2019 as a prototype. It is a bit like a combination of air cooling and liquid coolin...
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22
Nov, 2023
Huawei Mate60 Pro Uses VC Cooling SolutionVapor Chamber is a new type of two-phase flow heat dissipation technology, which has advantages such as high thermal conductivity, good temperature uniformity, and reversible heat flow direction. I...
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20
Nov, 2023
Shinetsu Chemical Developed Thermal Pad For High Voltage Electric Vehicle Com...Recently, Shinetsu Chemical Co., Ltd. announced the development of the TC-BGI series of silicone sheets for the heat dissipation of increasingly high voltage electric steam components. Currently, e...
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20
Nov, 2023
In Response To Battery Short Circuit Thermal Runaway, Enoix Launches BrakeFlo...Recently, Enoix Corporation (Enoix), a new generation 3D silicon anode lithium-ion battery design manufacturer, announced its latest BrakeFlow ™ Technology, which is an internal battery therm...
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20
Nov, 2023
NEOcore Thermal Channel Technology Provides New Possibilities For High-power ...The current power and performance of electronic packaging are increasing, while product size is decreasing. The increase in product power density requires more effective thermal management to achie...
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20
Nov, 2023
Intel Ponte Vecchio GPU Needs Liquid CoolingPonte Vecchio is Intel's upcoming flagship computing GPU and the first product of Intel Xe HPC high-performance computing architecture. A Ponte Vecchio OAM computing module contains a total of ...
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18
Nov, 2023
Apple Is Developing A Graphene Cooling System For IPhone 16It is reported that Apple is developing a graphene cooling system for the iPhone 16 series to solve the overheating problem of the iPhone 15 Pro. This new type of heat dissipation material has exce...
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17
Nov, 2023
NVIDIA Launches Its First Mainstream Server Liquid Cooled GPUNVIDIA invented the GPU in 1999. This move has greatly promoted the development of PC game market and redefined modern Computer graphics, High-performance computing and artificial intelligence. The...
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17
Nov, 2023
TSMC Has Launched The AI Cooling Revolution And Collaborated With Multiple Ha...According to a report by Taiwan media's Economic Daily, due to the high demand for AI chips and server cooling, following the previous introduction of "immersive cooling efficient computin...
