News

At present, many users hope to install multiple GPUs in a system. Expensive computing cards like A100/H100 have always had high sales, but for relatively lower end users, the consumer grade GeForce...

Today , we received an inquiry for the copper pin fin heatsink from the Russia customer. It is for power device cooling applications . Thanks for the inquiry , Our engineering team is working on th...

Recently, Force Systems showcased a new AirJet active cooling chip solution at CES 2024, with a thickness of 2.8mm and a much higher cooling capacity per millimeter than traditional cooling methods...

According to reports, TSMC is intensifying cooperation with multiple hardware manufacturers to address the issue of excessive heat dissipation needs for AI chips and servers. Faced with the rapid g...

Recently, at the Computex Computer Show in Taipei, MSI also showcased the cooling design of the next generation NVIDIA RTX flagship graphics card. It is reported that MSI uses dynamic bimetallic fi...

Smartphones contain many components that generate heat, as well as many components that are prone to performance and lifespan being affected by heat. Without effective heat dissipation, the heat ge...

Media reports indicate that starting from B100GPU, Nvidia will shift its cooling technology from air cooling to liquid cooling for all products in the future, ushering in significant opportunities ...

Recently , we are working on the production of the 10pcs LED liquid cooling plate, the samples order were released from the Poland customer about 3 weeks ago, we finished and shipped the samples to...

Today, Sinda Thermal team received an inquiry for the intel 4189 platform EVAC CPU heatsink from the Korean customer. The heatsink is for 1U server CPU cooling , we sent a 3D drawing to customer fo...

Under the wave of AI big models, the demand for computing power supply is increasing. As a carrier of large-scale computing power, data centers bear an increasing amount of computing power, driving...

On April 23rd, Noctua launched the NH-L12Sx77 six heat pipe downwind air-cooled heatsink. The NH-L12Sx77 is a slightly higher variant version of the previous NH-L12S, which continues the fan design...

It is reported that Intel has announced the launch of an immersion liquid cooling system with Submers, called the "Forced Convection Heat Sink (FCHS)," which can cool chips with thermal d...