Intel LGA4677 1U EVAC Heatsink

        EVAC means Extended Volume Air Cooling , With increased processor cores and performance for CPU/GPU, thermal design power (TDP) of these products are also increasing .Traditional air-cooling seems not able to support higher TDP with limited size and spece, and liquid cooling solutions are still too expensive for mass production.Hence advanced air-cooling solutions like Extended Volume Air Cooling (EVAC) heat sinks are more ideal to adopt.

      The intel LGA 4677 1U EVAC heatsink is based on the eagle stream platform CPU applications. This heatsink design is using copper block,copper heatpipe,aluminum fin stack and aluminum die casting base , the themral components are joint together by soldering process . Thermal grease is pre-applied before shipment  for customer's convenience. 

     EVAC heat sink is characterized by their larger volume and unique fin design. Traditional heat sinks have limited surface area, resulting in poor cooling performance. However, EVAC heat sinks utilize their larger size and strategically positioned fins to increase the heat dissipation area and improve cooling efficiency.

      Enhanced cooling efficiency: EVAC radiator design improves heat dissipation, keeping electronic components at a lower temperature, thereby extending their service life and optimizing their performance.

      Reduced Noise Levels: The effective cooling provided by EVAC heat sinks allows the use of lower fan speeds, thereby reducing noise levels compared to traditional cooling solutions.

      Cost-effective: The EVAC radiator's expanded volume design optimizes its cooling performance and reduces the need for additional cooling components. This cost-effectiveness makes it an attractive solution for both individual consumers and large-scale industrial applications.

       Lower power consumption.