Intel LGA4677 4U CPU Heatsink
Cooling Principle The CPU heatsink transfers heat to the fins of the heatsink through silicone grease, copper pipe, base and other heat conducting media, and then uses a fan to blow away the heat. From the working principle, what can affect the heat dissipation effect is the heat conduction...
Product Introduction
| Part Number | SD-4677-4UM97 | Fan Voltage | 12V |
| CPU Socket | Intel LGA4677 | Fan Speed | PWM 1000-2200RPM |
| Server System | 4U Server | Noise | 36.0dBA (MAX) |
| Heatsink Dimension |
125mm*102.6mm*155.0mm |
Air Flow | 72.68CFM (MAX) |
| Heatsink Material |
Aluminum Base, Copper Plate Aluminum Fin , Copper Pipe |
Fan Connector |
4 pin PWM |
| Surface Treatment | Nickel Plated | Fan Bearing | Double ball bearings |
| Thermal Design Power | 350W | Warranty | 1 Year |
Cooling Principle
The CPU heatsink transfers heat to the fins of the heatsink through silicone grease, copper pipe, base and other heat conducting media, and then uses a fan to blow away the heat. From the working principle, what can affect the heat dissipation effect is the heat conduction effect of the heat conduction medium and the size and speed of the fan.
Therefore, a good thermal heatsink must have a smooth base, heat pipe with strong thermal conductivity, a good fin design (contact process, quantity, area, etc.) and a fan with fast and large speed.
The heat exchange efficiency of the tower heatsink is higher than that of the down pressure heatsink. When the air flow passes through the cooling fins in parallel, the air flow speed on the four sides of the air flow section is the fastest. At the same time, the tower heatsink is also conducive to the construction of the air duct inside the chassis, which can guide the air flow to be discharged from the cooling port at the rear of the chassis as soon as possible.
Benefits and Advantages of Tower Heatsink Design
The tower heatsink is basically about three times that of the down pressure radiator, that is, the area of the cooling fins of the tower heatsink is about six times that of the down pressure heatsink when the thickness is the same.
Large chassis and high-end motherboards generally do not use down pressure heatsinks, because high-end motherboards will be equipped with cooling modules for components that need cooling, so tower heatsinks are the best choice with follwing benefits
larger Cooling Area at the same dimension.
The larger area of cooling fins, the better cooling effect will be
one-way side blowing air flow
This will not affect the air duct of the chassis.
Enhanced cooling efficiency
The fan blow to the cooling fins and heatpipes, keeping electronic components at a lower temperature in a shorter cycle
who choose us?
Sinda Thermal is devoted to a range of heat sinks which are widely used
in new power supply, New energy vehicles, Telecommunications, Servers,
IGBT, Madical and Military. All the products accord with Rohs/Reach
standard, and the factory is qualified by ISO9000 and ISO9001.
Our company has been a partner with many customers for good quality, excellent service and competitive price. We are a leading heat sink manufacturer for the global customers .
one-stop solution
professional team
high quality
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