Intel LGA4677 2U Standard CPU Heatsink
Product Introduction: Intel LGA4677 1U Standard CPU Heatsink How Does Heat Sinks Work Heat sinks transfer heat away from a device or heat source and into the surrounding environment using conduction, convection, and radiation. Generated heat is conducted through a high thermal conductivity heat...
Product Introduction
Intel LGA4677 2U Standard CPU Heatsink
| Part Number | SD-4677-2UM81-P | Fin Thickness | 0.35mm |
| CPU Sockelt | Intel LGA4677 | Fin Pitch | 1.65mm |
| Server System | 2U standard Server | Standard Hole Distance | 102.5mm*57.6mm |
| Heatsink Dimension |
118mm*78mm*63mm |
Heatsink Material | Copper & Aluminum Base+ Aluminum Fin+5 copper heatpipes |
| TPD | 300W | Thermal Interface Material |
Shin-ETSU,7921 or DOW CORNING,TC-5888 grease, 0.15-0.2mm Thickness |
How Does Heat Sinks Work
Heat sinks transfer heat away from a device or heat source and into the surrounding environment using conduction, convection, and radiation. Generated heat is conducted through a high thermal conductivity heat sink base which conducts energy into heat sink fins. Heat sink fin added surface area increases heat transfer to the surrounding air with conduction. As air passes over these heat sink fins, it absorbs the heat from the heat sink and convects it away, either through natural convection or forced convection with a fan or blower.
High Densities Fin and More Design Flexibility
A high density zipper fin stack is typically soldered, brazed, or epoxied to a heat sink base or a series of heat pipes to create a comprehensive thermal management assembly. As zipper fins are joined together on both the top and bottom of the fins, they offer higher mechanical stability compared to other fin types such as skived or folded fins.
For different performance requiremnet, Sinda Thermal also can support on the flexible heatsink design to optimize customer's need on heatsink performance improvement.
Reflow soldering is one of the main processes of heatsink assembly. Reflow soldering is mainly used to weld the assembled thermal parts, melt the solder paste by heating to weld the parts together, and then cool the solder paste through the cooling of reflow soldering to solidify the components and solder paste together, and decrease the thermal resiatance between the thermal components.
Originally, the solder paste is mixed with some chemicals such as metal tin powder and flux, but the tin in it can be said to exist independently as small tin beads. After passing through the equipment such as reflow furnace, after several temperature zones and different temperatures, when the temperature is greater than 217 ℃, those small tin beads will melt. Through the catalysis of flux and other items, countless small particles will melt into one.
Golden sample or limit sample will be needed for every production performance verification , the themral spec is defined and used as the reference data to make use the stable performance heatsink production before shipping.
Base on the different testing equipment ,testing method, ambient temperature, the actual testing data may have difference , the Heatsink Thermal Performance Spec listed is for reference only .
FAQ
01.Can we have free sample for thesting before release PO for production?
02.What's the MOQ for this heatsink?
03.Do we still need to pay for the tooling cost for this standard parts?
04.How long is the LT?
05.Is it possible to have some design optimization on the heatsink if customer needs ?
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