Intel LGA4677 2U Fan Cooler Heatsink
CPU Cooling System Working Principle A CPU cooler is a device used to cool down the heat generated by a computer's central processing unit (CPU). It works in much the same way as an air conditioner, with fans drawing away hot air and circulating cold air around the processor. The cooler's...
Product Introduction
| Part Number | SD-4677-2UM87 | Fan Voltage | 12V |
| CPU Socket | Intel LGA4677 | Fan Speed | PWM 3000-11000RPM |
| Server System | 2U Server | Noise | 52.50dBA (MAX) |
| Heatsink Dimension |
118mm*79mm*64.5mm |
Air Flow | 47.20CFM (MAX) |
| Heatsink Material |
Aluminum Base, Copper Plate Aluminum Fin , Copper Pipe |
Fan Connector |
4pin PWM |
| Surface Treatment | Nickel Plated | Fan Bearing | Double ball bearings |
| Thermal Design Power | 400W | Warranty | 1 Year |
CPU Cooling System Working Principle
A CPU cooler is a device used to cool down the heat generated by a computer's central processing unit (CPU). It works in much the same way as an air conditioner, with fans drawing away hot air and circulating cold air around the processor. The cooler's construction typically consists of a base that sits atop the CPU, fins or plates connected to it which form pathways for airflow, and at least one fan that uses this airflow to draw out hot air.
Function of CPU Heatsink
When the CPU is working, it will produce a lot of heat. If these heat are not dissipated in time, it may cause crash at least, or it may burn the CPU. The CPU heatsink is used to dissipate heat for the CPU. Heat sink plays a decisive role in the stable operation of CPU. It is very important to choose a good heat sink when designing the thermal system.
It is very important to choose a good heatsink for the CPU, with a good thermal performance, the CPU heatsink will help to make the whole system working in stable. The heatsink material, fan material, fan speed,noise and other parameters are need to be considered.
When designing the heatsink, the engineer should not only focus on the cost ,the heatsink performanace , production reliability,material and other factors should also be in consideration. If the resource permits, it will be very helpful to run a thermal simulation before sample build, which will help to shorten the R&D cycle.
Heatpipes, copper plate, base and fin are the main components of the current mainstream intel LGA4677 CPU cooling heatsink. Each part will have an important impact on the thermal efficiency of the heatsink, and the parts are also interrelated. Simply enhancing one part may not bring a qualitative leap to the efficiency of the heatsink, but any part has not been done well, It is a heavy blow to the efficiency of the CPU heatsink.
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