Aluminum Heat Sink Extrusion For PCB Board Card

  Electronic components will generate heat when they are working. If the heat cannot be dissipated in time, the temperature will continue to rise. When the temperature exceeds a certain level, the components may fail or even burn out. Therefore, it is very important to dissipate heat from the electronic components. For components that can be equipped with heat sinks, the heat sinks can play a very good role in heat dissipation.

  PCB board contains a lot of electronic components which will generate the heat, so proper thermal management in PCB design will help to produce more reliable and economical product equipment. Local overheating of the PCB often leads to partial or even complete failure of the device. Thermal failure means that we need to redesign the PCB. How to ensure proper thermal management techniques are used to protect your circuit board, here are 3 tips to help you with your projects:

1, Design a PCB layout for efficient heat distribution

  A variety of PCB design techniques can be used to control the distribution of heat at no additional cost. Here are some design suggestions:

Temperature-sensitive components need to placed in the coldest area (such as the bottom of the device), never directly over a heat-generating device, preferably staggering multiple heat-generating components on a horizontal plane.

The heat sources on the same printed circuit board should be arranged as closely as possible according to the degree of heat output. The upstream of the cooling fan can place low heat-resistant components or parts (such as small signal transistors, small integrated circuits, electrolytic capacitors, etc.), while high heat-generating components or high heat resistance components (such as power transistors, large-scale integrated circuits, etc.) etc.) should be placed downstream of the cooling stream.

2, The temperature measuring element should be placed in the hottest area for the most accurate temperature measurement.

  Components with the highest power dissipation and heat output should be placed where the heat dissipation is optimal. Do not place high temperature components on the corners and edges of the PCB unless there is a heat sink nearby. When it comes to power resistors, choose larger components as much as possible, and allow enough space for heat dissipation when adjusting the PCB board layout.

The heat dissipation of a device is largely dependent on the airflow within the device, so air circulation in the device should be studied in the design, and components or printed circuit boards should be properly positioned.

Horizontally, high-power components should be placed as close to the edge of the PCB as possible to shorten the heat transfer path. In the vertical direction, the effects of air reflections or heat sensitive elements being blocked by taller components should be considered. For devices that use natural convection air cooling, it is best to arrange the integrated circuits (or other components) in either vertical or horizontal order.

Additionally, thermal pads and PCB vias can be added to improve thermal conductivity and promote heat transfer to a larger area. The thermal pads and vias should be as close to the heat source as possible. The vias can conduct heat to the ground plane on the other side of the board, helping to distribute the heat evenly across the PCB.

3, Add heat sinks, heat pipes, fans to high heat devices

  If there are several (3 or less) heat generating devices on the PCB, you can add a heat sink  to the heat generating element. If the temperature cannot be lowered sufficiently, a fan can be used to enhance cooling. When the number of heating devices is large (more than 3), a larger heat sink can be used, and a larger flat heat sink can be selected according to the position and height of the heating device on the PCB, and according to the different size of the components, a custom heat sink is available. For PCB board card, aluminum heat sink extrusion is the most widely used thermal solution, as the PCB board card heat sink requires excellent thermal performance and easily manufacturing, based on these two points, 6063 aluminum alloy is the best choice for the extruded heat sink, because it ont only meet these two conditions, but also it is cost-effective.

What is Extrusion:

  Aluminum extrusion is a kind of frame profile obtained by heating the aluminum rod to an appropriate temperature and then extrusion forming through a hard tooling.

   Aluminum Extrusion heatsink is one of the most simple and cost saving

thermal solution for many low TDP application, by using tooling extrusion and CNC machining process , we can make thousands of different sink for custom and semi-custom air cooled solutions.

Drawing Spec : 

Varieties of heat sink

Thermal simulation





Extruding process



Certificates

Certifications:

Sinda Thermal is a leading thermal manufacturer in China, our factory was founded in 2014, and located in Dongguan city, China, we are offering varieties of heatsinks and other precious metal parts. Our plant possesses 30 sets advanced and high precious CNC machines and stamping machines, also we have many testing and experiment instruments and professional engineering team, so our company can manufacture and provide high quality products with high precision and excellent thermal performance. Sinda Thermal is devoted to a range of heat sinks which are widely used in new power supply, New energy vehicles, Telecommunications, Servers, IGBT, and Madical. All the products accord with Rohs/Reach standard, and the factory is qualified by ISO9001 and ISO14001. Our company has been a partner with many customers for good quality, excellent service and competitive price. Sinda Thermal is a great heat sink manufacturer for the global customers .


FAQ
1. Q: Are you a trading company or manufacturer?
    A: We are a leading heat sink manufacturer, our factory has been founded over 8 years, we are professional and experienced.

2. Q: Can you provide OEM/ODM service?
    A: Yes, OEM/ODM are available.

3. Q: Do you have MOQ limit?
    A: No, we don't set up MOQ, prototype samples are available.

4. Q: What's the lead time of the production?
    A: For prototype samples, the lead time is 1-2 weeks, for mass production, the lead time is 4-6 weeks.

5. Q: Can I visit your factory?
    A: Yes, Welcome to Sinda Thermal.

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