5G Base Station Liquid Cooling
1. What is 5G?
As the fifth generation mobile communication system, 5G technology has the main advantages of large transmission bandwidth and low delay: the maximum bandwidth is up to 10Gbit / s, and the amount of data transmitted is 100 times that of 4G; The network latency is less than 1 ms, compared with 30-70 MS for 4G. The low delay feature of 5G makes it possible for intelligent manufacturing factories, Driverless , remote HD medical surgery, etc.
2. Introduction to 5G base station:
At present, there are 50 5G networks in the world, and may increase to 80 in 2021. China will have 1 million 5G base stations by 2021. There are two kinds of 5G base stations, one is macro base station and the other is micro base station.
Macro Base Station:
Macro Base usually has a big size,and built ourdoors to cover a large area.
Micro Base Station:
Mainly built in urban areas and indoors. In the 5G time, there will be more micro base stations installed everywhere.
3. Thermal challenge for 5G base station:
The increase of 5g base station power consumption will mean the increase of calorific value, which will lead to the increase of chip temperature.
Traditional cooling solution:
1. By using high thermal conductive material,thermal bridge block or heat pipe to reduce the temperature difference between the chip and the shell.
2. Increase the shell volume of the equipment, optimize the design of cooling blades and increase the surface area to reduce the shell surface temperature.
3. Using die casting aluminum shell to improve the temperature uniformity .
For solution 1, When the shell is exposed to sunlight, its surface temperature can be as high as 60 ℃ to 90 ℃. The TC of many chips is required to be within 90 ℃, which will not meet the heat dissipation requirements; For solution 2 &3 , usually ,the appearance size and weight of the product are limited and cannot be increased easliy. Therefore, 5G heat dissipation will be a great challenge.
4. liquid cooling solution for 5G base station:
Therfore , we provide serveral thermal design for the newly cooling for 5G thermal system, the heat dissipation power of a single CPU is 100W-300W, the inlet and outlet temperature difference is 1-5 ℃, and the pressure drop is 5-20kpa. This has many advantages:
1. Low temperature difference between 2 CPU.
2. Low temperature difference betweenCPU and radiators.
3. The temperature distribution of the radiator is uniform and the surface temperature difference is low.
4. One stop liquid cooling heat dissipation for multiple heating devices.
Design 1:
Design2:
Design3:
5. New technology development:
The aluminum vapor chamber realizes the temperature equalizing function through the internal phase change working medium. The cost is much lower than that of the copper vapor chamner . At the same time, it can achieve the temperature equalizing effect in a large area,which is much cost effective and high efficiency.
Sinda Thermal will keep learing the new technology development in thermal industry, and share more successful case with our customers. Please contact with us for any thermal product customization service.
website: www.sindathermal.com
contact:castio_ou@sindathermal.com
Wechat: +8618813908426
