Copper Vapour Chamber Heatsink

Copper Vapour Chamber Heatsink

Copper Vapor Chamber sink operate like heat pipes, using evaporation and condensation of a fluid sealed under vacuum within a metallic envelope to transport heat.

Product Introduction

Product Description:

Copper Vapor Chamber sink operate like heat pipes, using evaporation and condensation of a fluid sealed under vacuum within a metallic envelope to transport heat. When heat pipes assembly cannot offer enough design flexibility or heat spreading for your solution, vapor chamber sink are the ideal next step. Typical copper-water sintered powdered wick provides high-heat flux heat dissipation, with some configurations reaching over 300 W/cm2.

Customers can improve the thermal performance of their Heat Spreading Assembly up to 30% when compared to typical aluminum or copper base spreaders. Making the switch to a Heat Spreading Vapor Chamber sink

includes all the benefits of added thermal performance, freeze/thaw resilience, and ability to withstand military shock and vibration standards without sacrificing the reliability of the assembly.


Vapor Chamber Structure:

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Prototype and Qualification Development Process:

• Prototype Fabrication

– Machining

– Vapor Chamber Fabrication

– Epoxy, Soldering, & Brazing

– Custom Integration and Assembly

• Prototype Testing

– 100% Thermal Validation Testing

– Air Flow Measurement and Analysis

– Wind Tunnels - Controlled Volumetric Airflow

– Data Collection & Reporting (Pressure, Temperature, Flow)

• Qualification Testing

– Thermal Cycling & Thermal Shock

– Shock & Vibration Testing

– Packaging Drop Testing


Fetures & Details:

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Why Chose Copper Vapour Chamber Heatsink:

• More uniform heat spreading for cooler device temperatures.

• Vapor chambers may also be inserted into pockets with an extruded or cast heat sink base by soldering or thermal epoxy.

• Reduce thermal solution complexity by using one vapor chamber as opposed to multiple heat pipes with complex bent geometries.

• Fins such as Zipper Fin or Folded Fin may be mounted directly to vapor chambers by soldering.

• Higher through conductivity than graphite for thicker applications.

• Successfully thermally cycled from -40°C to +85°C.


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