AI accelerates chip level liquid cooling explosion

    AIGC is based on big models and big data. The generative models/multimodality in AIGC mainly meet the demand for intelligent computing power. In 2021, the total computing power of global computing devices/intelligent computing power scale was 615/232 EFlops, and it is expected to increase to 56/52.5 ZFlops by 2030, with a CAGR of 65%/80%; the average computing power doubling time will be reduced to 9.9 months.

   With Intel CPU power exceeding 350W and Nvidia GPU power exceeding 700W, the computing power density of AI clusters generally reaches 50kW/cabinet. The cabinet power exceeding 15kW is the ceiling of air cooling capacity, and the thermal conductivity of liquid is 15-25 times that of air. There is an urgent need to upgrade liquid cooling.

   The global AI server market size is expected to reach 15.6 billion US dollars in 2021 and 31.8 billion US dollars by 2025, with a CAGR of 19.5%. The Chinese AI server market size is expected to reach 35 billion yuan in 2021 and 70.2 billion yuan by 2025, with a CAGR of 19.0%. AIGC is expected to further drive growth. The demand for AI server chip level liquid cooling is in the billions: estimated to be 22.3-33.3 billion yuan and 7.2-10.8 billion yuan in the global and Chinese AI server liquid cooling markets by 2025.Therefore,the AI will accelerates chip level liquid cooling explosion in the coming future.