Intel LGA 1700 Copper Skived Fin CPU Heat Sink

Skiving technique

Skived fin heat sink provides maximum heat dissipation performance in a given volume and space, this structure owns thinner fins, high apect ratio and denser fin pitch, so in a given volume, it can offer more fins and heat dissipation area to dissipate the heat faster than solid metal heat sink such as extruded heat sink or die casting heat sink. Also as the skived fins are sliced from the base, there is no joint between the fins and base, so the thermal resistance is very low which makes the skived fin heat sink has great thermal conductivity to remove the heat from the CPU rapidly. The skiving technique is utilizing a blade to slice the fins from a metal bar, so there is no Non-Recurring-Charge cost, this process is very cost efficient, also is very flexible to build prototype samples for thermal verification. Sinda Thermal is very experienced in manufacturing varieties of skived fin heat sinks, If you want to learn more about skiving technique, please feel free to contact us.

Applications of skived fin heat sinks

Skived fin heat sinks are manufactured by utilizing a sharp and accurate blade to peel the fins from a solid metal bar, usually is copper or aluminum, the blade tool slices a thin metal sheet and bends it vertically to form a fin, this process requires low tooling cost and flexible lead time. Skived fin heat sink is widely applied in many industries as it has plenty of benefits:

1, High apect ratio, quite thin fins, and dense fin pitch to form an excellent thermal performance structure;

2, No interface joint between the fins and base to make the thermal resistance very low;

3, Low tooling cost and flexible lead time.

The skived fin heat sinks are mainly used in:

1, Computers and other electronic components;

2, Telecommunications equipment;

3, Industrial equipment and components;

4, LED and household appliances.