Passive Heatsink For BGA

  As electronic devices such as computers, smartphones, and gaming consoles are becoming more and more advanced, so the demand for high-performance electronic components is increasing as well. However, the high power electronic components will generate huge amount of heat, the heat could affect the working efficiency of the components and even damage the electronic parts. As heat is the primary enemy of electronic devices as it can lead to their malfunction and even irreparable damage, so a thermal solution to dissipate the heat generated by these components is necessary, passive heat sink is one of the most effective thermal solutions. Passive heat sink is the most commonly used thermal device in electronic devices, it requires no power source or any moving parts, making them quieter and more reliable than their active counterparts.

 

 

Why does a BGA need a passive heat sink?

  A Ball Grid Array (BGA) is a type of chip package used in electronic devices that have high-density circuits, BGAs have several advantages such as higher component density, lower power consumption, and better thermal performance compared to other packaging types. However, with increased device density comes the challenge of heat dissipation. The heat generated by the BGA needs to be dissipated to prevent damage to the device, the BGA's small package size means that there is limited space for an active cooling device such as a fan or a liquid cooling system, so a passive heat sink is the most appropriate solution for dissipating the heat generated by the BGA.

 

 

The main types of passive heat sink

 

1. Extruded heat sink

  Extruded heat sink is the most commonly used heat sink in the electronics industry, it is made by pushing aluminum or copper through a die to create a specific shape, this process allows for customization of the heat sink's design, including the number of fins and the overall size. Extruded heat sinks have good thermal performance and can dissipate heat efficiently. 

 

 

2. Folded fin heat sink

Folded fin heat sink is made by stamping a rolled metal sheet into shape. The fins are formed by stamping and folding the metal sheet, which creates an extended surface area for better heat dissipation.

Folded fin heat sink has a compact design and are ideal for devices that require a low profile. it is also customizable, making it possible to create different fin shapes and sizes for optimizing heat dissipation.

 

 

3. Stacked fin heat sink

Stacked fin heat sink is made by stamping aluminum or copper sheets into stacked fin assembly, the sheets are interlocked with designed pitch and zippered together to create the fins assembly. Stacked fin heat sink has a large surface area and excellent thermal performance, it is also customizable, making it suitable for devices with specific cooling requirements.

 

 

 

 

 

 

Varieties of heat sink

Thermal simulation

Factory and workshop

 

Certificates

 

 

  Sinda Thermal is a leading thermal manufacturer in China, our factory was founded in 2014, and located in Dongguan city, China, we are offering varieties of heatsinks and other precious metal parts. Our plant possesses 30 sets advanced and high precious CNC machines and stamping machines, also we have many testing and experiment instruments and professional engineering team, so our company can manufacture and provide high quality products with high precision and excellent thermal performance. Sinda Thermal is commited to a range of heat sinks which are widely used in new power supply, New energy vehicles, Telecommunications, Servers, IGBT, and Madical. All the products accord with Rohs/Reach standard, and the factory is qualified by ISO9001 and ISO14001. Our company has been a partner with many customers for good quality, excellent service and competitive price. Sinda Thermal is a great heat sink manufacturer for the global customers .


FAQ
1. Q: Are you a trading company or manufacturer?
    A: We are a leading heat sink manufacturer, our factory has been founded over 8 years, we are professional and experienced.

2. Q: Can you provide OEM/ODM service?
    A: Yes, OEM/ODM are available.

3. Q: Do you have MOQ limit?
    A: No, we don't set up MOQ, prototype samples are available.

4. Q: What's the lead time of the production?
    A: For prototype samples, the lead time is 1-2 weeks, for mass production, the lead time is 4-6 weeks.

5. Q: Can I visit your factory?
    A: Yes, Welcome to Sinda Thermal.

 

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