Application of thermal PAD in motherboard IC

     The thermal conductive soft silicon PAD between the main board IC and the heat sink or shell has more advantages in the heat dissipation application of the main board IC than the traditional thermal conductive medium materials, such as thermal conductive silicone grease, traditional thermal conductive gasket, thermal conductive ceramic sheet and thermal conductive phase change material.

      Under the same K value and the same service environment, the thermal conductive soft silicon PAD can better compress and increase the effective contact area, so as to improve its thermal conductivity from the surface. Thermal conductive soft silicon PAD has been widely used in the heat dissipation of mainboard IC. Thermal conductive soft pad film is a sheet material, which can be cut arbitrarily according to the size and shape of mainboard IC heating power device. It has good thermal conductivity and insulation characteristics. Its function is to fill the gap between heating power device and radiator, It is an ideal product to replace the binary heat dissipation system of thermal conductive silicone grease thermal conductive paste.

      The thermal conductivity ranges from 1 to 8, and the process thickness ranges from 0.3mm to 5mm. It can also be increased to 10mm according to the special requirements of customers. When the thickness increases, the performance is unmatched by other thermal conductive materials. The application of thermal conductive soft silicon pad in the cooling of motherboard IC has been very mature. It not only has good thermal conductivity effect, but also is very convenient for production line construction. Thermal conductive soft silicon pad has its own viscosity, super soft and easy to operate. Tear off the protective film to keep the bonding surface clean and smooth. It can be pasted once. The working temperature is generally - 50 ℃ ~ 200 ℃. It is a very good thermal conductive material for industrial products.

   Thermal conductive soft silicon pad is not only well used in the heat dissipation of mainboard IC, but also successfully and widely used in high-efficiency and high heating equipment such as automobile, high-end industrial control and medical electronics, mobile and communication equipment, high-speed mass storage driver and so on.