Buried heatpipe process application in liquid cold plate

       Liquid cooling plate heatsink has a very good thermal perfromance  on the heat dissipation of high-power devices, so many customers will choose the thermal solution of liquid cooling plate . The production process of liquid cooling plate is more complex than that of general air-cooling radiator, and liquid cooling heat dissipation requires high process reliability and technology.

      The buried heatpipe  process is the most commonly used customized process for making liquid cooling plate . Generally speaking, it is the buried copper pipe on the aluminum substrate,  the aluminum substrate is processed and milled with CNC, and then the bent copper heatpipe is pressed into the aluminum substrate with a stamping machine, after brazed and welded, and then processed into a liquidcold plate.

     There are generally three kinds of buried heatpipe liquid cooling plate: one is shallow buried tube liquid cooling plate; The second is the deep buried pipe liquid cooling plate; The third is pipe welding process; . There is little difference in the three kinds of different technology, and the difficulty of processing is almost the same.