Commonly used lamp radiator design

       In the case of domestic chip and packaging technology that is not yet mature, the system design of the lamp is particularly important. How to make the life of the chip and the light quality in the best condition has become the top priority for lamp manufacturers.

       In fact, the main factor affecting the above is "heat". Each chip has a node temperature. This temperature must be controlled within 85°C to ensure the best working condition of the chip.

       So how can we ensure that the heat transfer from the chip, aluminum substrate, and heat-conducting material to the radiator can be smoothly and efficiently transferred to the surrounding environment?

       In addition to the meticulous design of the structure of each link, the selection and processing of each link must be carefully considered and tested to achieve the best working condition.

       Aluminum profile is a standard part. When we design it as a radiator, it is mainly based on the principle of aerodynamics.

       When designing a radiator by aluminum alloy die-casting, in addition to considering the aerodynamic principle, it should also consider whether the heat dissipation area is sufficient. Increasing the heat dissipation area can be achieved by making the heat sink thinner and taller. In addition, due to the die-casting technology, the structure of the lamp can be designed as a whole.    

       The overall material of the lamp is the same, and the heat transfer is more efficient in the same medium. The lifetime and light quality of the lamps can also be better guaranteed. This is also the technical reason why aluminum alloy die-cast structure radiators are popular now.