Difference of Micro and Large heatsink

    Any electric device has a certain loss when working, and most of the loss becomes heat. Low power devices have low loss and no heat dissipation device is required. The high-power device has large loss. If heat dissipation measures are not taken out in time, the temperature of the tube core can reach or exceed the allowable junction temperature, and the device will be damaged.

    Therefore, a heat dissipation device must be added. The common way is to install the power device on the heatsink, use the heatsink to dissipate the heat to the surrounding space, and add a cooling  fan if necessary to strengthen the cooling and heat dissipation with a certain wind speed. Flowing liquid cold plate is also used on the power devices of some large equipment, which has good heat dissipation effect.

    Micro electronic heatsinks are usually made of aluminum alloy sheet by stamping process and surface treatment, while large electronic radiators are extruded from aluminum alloy to form profiles, and then made by machining and surface treatment. 

     They have various shapes and sizes for different device installations and devices with different power consumption. Heatsinks can be standard parts or customized profiles, which can be cut into a certain length by customers according to requirements to make non-standard radiators.