Custom Vapor Chamber

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Vapor chamber is a vacuum chamber with a capillary structure attached to the inner wall of the metal. When the heat generated by the device is conducted from the surface of the device to the ⅤC evaporation area, the working fluid in the chamber is heated under a certain degree of vacuum to become vapour, the process is accompanied by rapid volume expansion, and the working fluid of the vapor phase flows rapidly to the entire cavity under the action of a small pressure difference. When the working fluid of the vapor phase contacts an environment slightly lower than the saturation temperature of the vapor phase transition, it will produce The phase change condensation phenomenon of saturated steam releases the heat absorbed during evaporation through the condensation phenomenon, and the condensed cooling liquid will be transported back to the evaporation area of the heat source through the capillary structure, and this operation will be repeated around the cavity.

 

Product specification

Material	C1020
Dimension	Customized
Surface finish	Passivation, nickel plated, or customized
Certification	ISO9000, Rohs, CE
Application	CPU/GPU, high power device
Packing	Standard packing

 

 

The work principle of vapor chamber

The base of the vapor chamber is heated, and the heat source heats the copper mesh micro-shaped evaporator to absorb the heat;

Coolant (pure water) is heated and quickly evaporates into hot air in a vacuum ultra-low pressure environment;

Vapor Chamber uses vacuum design, hot air circulates more quickly in the micro environment of copper mesh;

The hot air rises when it meets the upper part of the heat sink and dissipates heat, and then condenses into liquid again;

The condensed cooling liquid flows back into the evaporation source at the bottom of the heat equalizing plate through the capillary channel of the copper microstructure—reflux, the refluxed cooling liquid is heated by the evaporator and vaporized again and absorbs heat through the copper mesh micropipes> heat conduction> heat dissipation, so Repeated action.

 

The advantages of vapor chamber cooling

1. The thermal resistance of the vapor chamber is relatively low,  when 300W electronic device is applied to 25mmx25mm dimension vapor chamber, the thermal resistance is 0.05C/W.
2. The size of the finished product can be designed flexibly, and the common size is 200 mm x 200 mm.
3. Overcome the directional limitation and comprehensively improve the performance of electronic components/systems.

 

Our factory ability

Sinda Thermal has the ability of producing various heat sinks, we are experts in manufacturing vapor chamber, we possess adequate stamping facilities and CNC machines to support customer's requirements, and we have a lot of instruments and measurement tools to control our quality of custom vapor chamber, also we have over 100 employees to make sure enough capacity to meet our cusotomer's demand.

 

Our production plant

 

 

Our custom vapor chamber exhibition

 

 

FAQ

Q: Do all the products meet the Rohs certification?

A: Yes, all the heat sinks meet the Rohs certification.

 

Q: What's the MOQ for the custom vapor chamber?

A: No MOQ limit, we can provide the prototype vapor chamber to customer for testing.

 

Q: What's the lead time of the vapor chamber?

A: it depend on the quantity, basically the lead time is 6-8 weeks for mass production, 4 weeks for samples.

 

Q: Is the vapor chamber manufactured in house?

A: Yes, we manufactured the VC in our own factory.

 

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