EOS cooperates with CoolestDC to launch leak free integrated cold plate for server applications

    EOS, a well-known metal 3D printing product and technology service provider, announced on its official website that EOS, together with CoolestDC, a subsidiary of the National University of Singapore, has successfully developed the world's first leakless integrated cold plate applied to the server CPU (AMD EPYC 7352 2.30 GHz).

   It is the consistent goal of the industry to find alternatives to brazed and assembled cold plates to minimize the risk of leakage directly into chip (DLC) liquid cooling, reduce rack density, reduce power costs, and improve the sustainability of the data center.

 EOS development results show that:

The leak free integrated cold plate can withstand liquid pressure of 6 bar and above;

Reduce CAPEX investment, because the mold cost of different server motherboards is zero;

It supports free design and mass manufacturing, and the thickness, fin density and installation position of the cold plate can be customized.

     The application of the leak free integrated cold plate liquid cooling scheme will help reduce the carbon footprint and energy consumption of the data center. Specifically, the performance of IT equipment will be improved by 40%, the energy consumption will be reduced by 29% to 45%, the carbon footprint will be reduced by 30%, the rack space will be reduced by 20%, the CAPEX investment (chiller, elevated floor, etc.) will be saved by 15%, and the cooling water cost will be reduced by 9500 dollars/megawatt.