Heat dissipation of high thermal conductivity interface materials on different components in the power industry

1, the power supply can be divided into the following categories according to different standards:

1, according to the use of power can be divided into large power supply and small power supply;

2. According to the application, the scene is roughly divided into: adapter, UPS power supply, PC power supply, switching power supply, communication power supply, power rectifier, LED driving lighting power supply, etc.

3, according to the internal construction process is divided into: AT power supply, ATX power supply, Micro ATX power supply.

2, the primary use of thermal conductive silica gel on the power supply:

1, the main chip of the power: can be divided according to the power of the chip power, large power supply main chip general requirements will be high, such as: UPS power supply, because of its strong function of the power supply, the main chip to undertake the work of the whole body strength, at this time will condense a lot of heat, you will need to our thermal interface materials as outstanding thermal conductive medium.

2, MOS tube: MOS tube is in addition to the power supply of the main chip outside the heat of the larger components, the use of a variety of thermal conductive materials, such as: thermal silicon adhesive, thermal silicone grease, thermal silicone sheet, etc.

3, transformer: transformer is something of energy conversion, shouldering the conversion of voltage, current and resistance, but because of the special performance of the transformer, the use of thermal conductivity materials will also have special demand.

4, heat dissipation module and PDP TV heat dissipation module, power industry heat dissipation module: located on the chip and heat source to heat dissipation, connection radiator or structural heat dissipation.

The characteristics of thermal conductive silica gel sheet determine that it has an outstanding filling effect, especially the use of certain amount of contraction can make the thermal resistance smaller, better thermal conductivity.

The material itself also has outstanding electrical insulation and shock absorption, which is different from other thermal conductive medium materials.

3, widely used thermal conductive materials on the power supply:

1, thermal grease: used in the power supply main chip external radiator, such as: PC power supply, or with thermal silicon cloth used in MOS tube.

The use of thermal grease in the power supply is generally middle end materials, TIG780 series thermal grease products can fully satisfy most of the power demand.

2, thermal pouring sealant: branch of potting and all potting, partial potting will generally have the calorific value is bigger, and can't to replace with other thermal conductive materials, such as transformer surface is uneven and not rules, need is a can seamlessly wrapped it already, and still can't move about at thermal conductive materials, thermal conductivity potting glue is a good choice.

In addition, some power supplies work outdoors. While solving heat dissipation, waterproofing and sealing will be a bigger problem, so many power supplies are now all potting, sealing and heat dissipation.

With the vigorous development of LED industry, the selection and structure of the power supply for outdoor lighting, the demand for heat conduction potting glue will be a big market.

Sinda Thermal is professional thermal expert, we are offering many thermal solutions and heat sinks to the global customers, we can design the optimized performance heat sinks and manufacture them in house, our factory owns over 100 employees and many precise facilities and equipment. Please contact us freely if you have any thermal requirements.