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The high demand for computing power brought about by the explosion of innovative applications of AI and intelligent computing power will further promote the improvement of the overall power density of

According to Intel's official website, Intel researchers are exploring novel solutions to cool next-generation chips with powers up to 2000W. Intel said it will address the thermal challenges of next-

Driven by the generative AI craze triggered by ChatGPT and the high computing power requirements for autonomous driving and big data model applications, the AI ​​server market has maintained rapid gro

In order to address the heating issues of high-performance computing and ultra large scale data centers, Fujikura is developing a unique stacked cooling plate as a cooling component for the next gener

In the current pattern dominated by artificial intelligence driven applications and dense chip architectures, liquid cooling has become a key technology. By 2028, the liquid cooling market will grow a

The vapor chamber heatsink is composed of sealed copper plates and filled with a small amount of fluid (such as deionized water), allowing heat to quickly dissipate from the heat source. The uniform t

Thermal conductive ceramic gasket is a material with high thermal conductivity. It is mainly composed of alumina (alumina content is more than 96%), with pure white appearance and hard texture. It is

The use of a backplate with heatsink is a great way to reduce stress on a bga chip. Backplates are sometimes called a backup plate or bolster plate. Thermal systems engineers know that their designs m

With the development of smart terminals, an emerging technology used in smart terminals is the vapor chamber heatsink. It is an important supporting element in the research, development and production

New energy vehicle is a project supported by China. It has developed rapidly in recent years. The whole vehicle technology and parts technology of electric vehicle are also constantly innovated, and n

With the development of electronic devices and devices towards miniaturization, power consumption continues to rise, and the demand for high heat flux density heat dissipation is becoming increasingly

Driven by technologies such as cloud computing, generative artificial intelligence, and encrypted mining, the power density of data center racks continues to increase, and liquid cooling has become on