The thermal solution of new energy IGBT module

  As the core device of new energy conversion and transmission, the power range of the IGBT module is from hundreds of watts to a few mega watts, which is the "CPU" of the electrical electronic device. It is the application of general drives and renewable energy, such as industrial automation equipment, household appliances, rail transit, and new energy fields.

  The heat sinks on IGBT module

   The larger the current of the IGBT module is, the higher the switching frequency will be and the higher the module thermal power consumption will be. As a result, the loss of the IGBT module will be large and the device temperature will be too high.

If the temperature is too high, the efficiency of the module will decrease, and then the whole work progress will be affected.

Especially those components that need to work continuously, the IGBT module is more dependent on the need for a good thermal cooling system to do the guarantee.

Poor heat dissipation of IGBT module will directly cause damage and affect the operation of the whole machine.

In general, power electronic devices based on silicon devices must operate below 125 ° C and IGBTs must operate below 150 ° C, which can be extended to 200 ° C for future silicon carbide devices.

Thermal management of power electronics often requires the use of thermal conductive interface materials to connect the IGBT to the heat sink, and the interface plays a critical role in the overall thermal impedance and long-term performance.

 The IGBT module is mainly composed of a chip, a direct copper-clad ceramic layer and a substrate. The interlayer is welded by solder, and the substrate is generally connected to the radiator through thermal grease. It has low thermal resistance, high reliability, and will not evaporate and harden when exposed to high temperature for a long time. It is a good choice for new energy vehicle IGBT cooling.