Thermal Design of Military Electronic Equipment

        With the rapid development of science and technology, the electronic equipment involved in the field of national defense and military equipment has become increasingly complex, sophisticated and intelligent.  

        At the same time, due to the requirements of military applications for product miniaturization, light weight, customization and high reliability, engineers are faced with millimeter-wave electromagnetic compatibility during the design process, conduction cooling under high heat flux density, and sealing under harsh environments. A series of challenges.

       Thermal design challenges of military equipment  

       (1) The working environment of military equipment is complicated  Altitude, high temperature, low temperature, humidity, temperature shock, solar thermal radiation, shock vibration, icing, and various harsh environments (fungus, desert, dust, soot, etc.) all have varying degrees of influence on its thermal design.  

       In addition to complex boundary conditions, the biggest challenge in the thermal management of electronic products in the defense industry is the short-term thermal shock.  

       These electronic products are often exposed to an extreme thermal environment.  

       Suppose a jet fighter parked in the Caribbean Sea is now going to perform a mission.  

       The aircraft is at sea level at this time, and the temperature and humidity are very suitable.  

       When the aircraft takes off, it will be in a high-altitude, below-freezing temperature environment, and the boundary conditions of electronic products will be changed within minutes or even seconds. Therefore, the electronic products in the aircraft must be able to operate in a wide range of ambient temperatures Work.  

       (2) Large processing and high heat generation  

       Due to the nature of military tasks, these electronic products will inevitably lead to a relatively large amount of data processing, and at the same time require faster data processing speeds, correspondingly low, and the heat consumption of electronic products will increase sharply.  

       Therefore, the harsh environmental conditions and the rapidly increasing heat consumption of the chip make the thermal management of electronic products in the defense industry face huge challenges.  

       (3) Lightweight and perfect reliability increase the difficulty of thermal design  For electronic equipment in the atmosphere or outer space environment, weight is a very important element.  

       The lighter the weight, the longer the product will continue to work, and the lower the cost.  Obviously, due to the existing characteristics of jet fighters, missiles, tanks, etc., electronic products are in a harsh thermal environment, so the thermal reliability of electronic products in the defense industry is a very important factor.  

       Due to the high heat consumption of military electronic products and the harsh working environment, they usually present a higher heat flow. Similar to other electronic products, they must have a good cooling system, and the space size, weight, heat consumption, and heat consumption of the equipment must be considered. Electromagnetic shielding and other requirements.

        At present, many engineers prefer to use hybrid cooling methods for thermal design of electronic products.  

        Most electronic chips use air-cooled heat dissipation, and water-cooled heat dissipation devices are used for devices that consume a lot of heat.  

        But for electronic devices in space flight or outer space, this kind of heat dissipation method is not advisable, and a more compact liquid cooling system must be designed.  

        For example, the use of high thermal conductivity substrate materials, VC uniform temperature plates, heat pipes, TEC embedded in the chip Die, jet cooling or direct immersion liquid cooling, so that heat can be transferred to the liquid, and then to the liquid cooling system In the heat exchanger.  

        At present, the heat dissipation products used in military equipment and the core technology are all controlled by the head enterprises.  

        It is hoped that more heat dissipation materials with higher thermal conductivity and better processing performance will emerge in the country in the next few years, so that they can not only meet the heat dissipation of military electronic products, but also provide guarantee and protection for the normal operation of military electronic equipment, and can also be widely promoted. And used to solve the thermal control market of high-end civilian equipment, and promote the integration of military and civilian technology.