PCB Thermal Coating Technology Breaks Through 20 Degree Cooling

    Weigang has recently launched a new memory cooling technology that can effectively reduce the temperature of memory. This technology applies PCB heat dissipation coating to overclocking memory, which has good thermal conductivity, stability, and insulation effect.
     The use of this coating in memory can better transfer the heat generated by DRAM chips to the PCB and dissipate the heat through thermal radiation. According to the thermal imaging photos of XPG LANCER NEON 8000MT/s with and without heat dissipation coating, the temperature under load is 78.5 ℃ without coating; With the coating, under the same load, the temperature was only 70 ℃, with a decrease of 10.8%.