TSMC Announces Immersion Cooling Design

    Under larger chip areas and higher power consumption, power supply and cooling have become the most headache inducing issues for chip designers. Consumer grade graphics cards can also use the dual cooling design of both cooling and air cooling, while more high-end 3D packaging chips can only choose immersion cooling with higher cooling efficiency. TSMC stated at its annual technology seminar that the power consumption of each chip and rack unit in the computing field will not be limited by traditional air cooling.
   TSMC believes that when the chip packaging power exceeds 1000W, the data center needs to prepare an immersive liquid cooling system for AI or HPC processors, resulting in the need for a thorough restructuring of the data center structure. Although this technology faces short-term and sustained challenges, tech giants such as Intel are quite optimistic about immersive liquid cooling solutions and hope to push the technology into the mainstream.