Intel CPU Cooler LGA1700 2U Active Skived Fin Heat Sink
he LGA1700 2U skiving fin CPU cooler is an advanced cooling solution designed to meet the demands of high-performance computing. This innovative cooler features skiving fin technology, which enhances its thermal efficiency and ensures optimal heat dissipation. Skiving fin technology involves the process of cutting thin metal fins from a solid block, resulting in a larger surface area for heat transfer and improved cooling performance.
Product Introduction
| Part Number | SD-LGA1700-2U3C | Voltage | 12V |
| CPU Socket Type | LGA1700 Square Socket | Fan Speed | PWM 1700-4300RPM |
| Server Form Factor | 2U Server | Noise | 37.00dBA (MAX) |
| CPU Cooler Dimension | 90mm*89mm*47mm | Hole Location Distance | 78mm*78mm |
| Cooling Type | Active | TDP | 120W |
| Bearing Type | Two Ball | Fan Pin | 4pin PWM |
Product details

The LGA1700 2U skiving fin CPU cooler is specifically engineered for the LGA1700 socket, which is commonly used in high-end desktop and server motherboards. Its 2U form factor makes it suitable for rack-mounted servers and other space-constrained environments. This compact design allows for efficient airflow and heat dissipation, making it an ideal choice for systems with limited space for cooling solutions.
One of the key advantages of skiving fin technology is its ability to maximize the contact area between the fins and the heat source, such as the CPU. This direct contact enables efficient heat transfer, resulting in lower operating temperatures and improved overall system stability. Additionally, the skiving fin design reduces air resistance, allowing for better airflow and quieter operation.


The LGA1700 2U skiving fin CPU cooler is engineered to deliver exceptional thermal performance, making it an ideal choice for demanding applications such as gaming, content creation, and server workloads. Its robust construction and high-quality materials ensure long-term reliability and effective heat dissipation, even under heavy loads.
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