Aluminum Stamping Fin Heatpipe and Heatsink

Our Consumer Electronics CPU Heatsink, Stamping Fin Heatsink, Anodized Extruded Sink constantly promote innovation, design and develop new, beautiful, meet the needs of consumers. Our outstanding sales and service staff will strive to achieve optimum efficiency while maintaining quality. We have close technical cooperation relationship with our business partners, and we establish a high-quality and professional technical team, able to provide users with advanced and reliable products and solutions. We keep pace with the times, seek truth and pragmatism, seize the opportunity, seize the first opportunity, and ride on the momentum. Enterprise competition requires not only excellent product quality, but also profound cultural connotation.

About Stamping Fin Heatsink:

   Stamping fin heatsink can offer a thermal performance improvement of up to 20% compared with typical aluminum or copper base spreaders particularly in applications like electronics or computers, where the heat source is small relative to the area for fins.

    To ensure the best thermal contact based on application, we employ several methods to create these assemblies. Heat pipes can be directly soldered or epoxied into grooves within the heat sink base enabling direct contact with the heat source, or they can be embedded into holes using a proprietary expansion process that provides an efficient metal to metal thermal interface between the heat pipes and the heat sink base. enabling more rugged, reliable Heat Spreading stamping fin heatsink assembly.

Product Details:

Type:	Stamping fin heat Sink
Application:	Computer, cloud sever, Mobile eMobility, Telecom, Consumer electronics
Process:	Stamping, Die Struck Iron
Place of Origin:	DongGuan, China
Certification	GB/T19001-2016, ISO9001:2015
Surface Treatment:	Nickel Plated, Antioxidant,or customized
Warranty (Year):	5-Year
MOQ:	No limit
Shape:	Customized Shape
Size:	Customized Size
Thickness:	0.15-0.6MM Customized
Fin Material:	Aluminum or copper
Other Components:	Aluminum or copper Base, heatpipe, hardware, interface thermal material, etc

Advantages:

1. Thermal performance improvement of up to 20% over typical aluminum or copper base spreaders.

2. Greater than 300 W/cm2 heat flux heat dissipation capability.

3. Combine with zipper, folded, or bonded fin heat sink assemblies for maximum air cooling performance.

4. Reduce thermal interface resistance between the assembly and heat sources with thermal interface materials like thermal grease.

Product Exbition:

FAQ:

Q: How long is your delivery time?

A: It takes about 25 working days for soft tooling sample, and 42 days for hard tooling way in mass production.

Q: Can we make samples without tooling?

A: Yes, we can use soft tooling way to support your sample demand.

Q: What is your terms of payment?

A: Usually 100% payment before shipment. For regular customers, the terms can be nogotiated.

Q: Do you provide samples?

A: Yes, we could offer paid sample for prototypes testing if there is stock.

Our Aluminum Stamping Fin Heatpipe and Heatsink design principles are to maximize productivity, reduce device size and power consumption, and minimize the impact of technology on climate and the environment. After years of research and exploration in the field of new materials, our company has been developed to date, integrating R&D, production and sales. We achieve timely quotation for online transactions, along with qualified production, on-time delivery, and quality assurance.

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