Building Material Copper Stainless Clad Steel Plate

We are a leading company concentrates on R&D, manufacture, sale and after-sale service, specialize in producing and devloping high-quality Stamping Plate, AMD CPU Back Plate, Stamping Fin Heatsink, and our products have been exported to many countries and regions. In the process of market globalization, we are willing to work with friends from all walks of life to meet all kinds of challenges with enterprising spirit. In the course of the future, we will open up the space for career development with our unique talent strategy. We have established a long-term close cooperative relationship with large companies to realize the sharing of product and service resources and jointly provide users with reliable products and high-quality services.

Description:

Copper bolier plates enable high heat transfer from high flux heat sources like CPUs and GPUs with no moving parts, enabling greater reliability and longer product lifetimes. Customers can boost performance for chips with high heat dissipation where standard air cooled or liquid cooled solutions cannot meet application requirements.

Specification:

Contact Plate:

Solid copper base plate

Copper/water vapor chamber

Boiling Enhancement Surface (BEC):

Sintered copper powder

Mounting Frames (Optional)

Aluminum

Features & Details:

Benefits & Advantages:

High thermal conductivity and small space occupation

Flexible customization

Fast response and available solution apply

FAQ:

Q: What’s the lead time of this kind of heatsink?

A: Normal LT is 6-8weeks.

Q: Is there any MOQ requested?

A: No MOQ limited.

Q: Where’s your factory located?

A: We located in DongGuan, China.

Q: How can I get the quotation?

A: Please send us the emails with your drawings, requirements, spec, We will reply to you within 24 hours.

We plan to reduce the manufacturing cost of Building Material Copper Stainless Clad Steel Plate products through continuous technological innovation and expansion of production scale. Our company has strong technical force, advanced management and a young team full of creativity and corporate cohesion. We want to surpass ourselves, improving product systems, quality systems, and management systems.

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