CPU Cooler for Intel LGA 115X/1366/2011/2066/AMD Series

Our product competition intensifies, but the Heat Sink Extrusion By The Foot, CPU Cooler, Extruded Aluminum Heatsink Stock application market is constantly expanding and developing. We will serve our customers with our own action and wisdom, fair and reasonable price, and good after-sales service. We establish a comprehensive view of safety, life, production, cherish the lives of employees, cherish the health of employees. We strive to grasp, grasp and grasp the strategic focus, and improve labor productivity, return on investment and efficiency of resource allocation. The company has advanced equipment, strong technical force, reliable reputation and good service. With flexible operation, we warmly welcome new and old friends from all walks of life to write to us, come to consult and negotiate.

Product Overview:

To ensure the best thermal contact based on application, we employ several methods to create these assemblies. Heat pipes can be directly soldered or epoxied into grooves within the heat sink base enabling direct contact with the heat source, or they can be embedded into holes using a proprietary expansion process that provides an efficient metal to metal thermal interface between the heat pipes and the heat sink base.

For high performance air cooling system, we provide 6 Heat Pipe CPU Cooler design solution to support up to 450W TDP. Customers can add more or reduce heatpipe quantity based on their actual requirement. This design mostly used on desktop computer CPU, server CPU, data center and other customized applications.

Product Information:

Product Name:	6 Heat Pipe CPU Cooler
Material:	Aluminum + copper + others
Power:	165W-450W
Air Flow Rate	30CFM-80CFM
Product Size:	Customized
MOQ:	No Limit
Sample Time:	10 DAYS
Mass Product Lead Time:	20-35 DAYS
Certification:	GB/T19001-2016, ISO9001:2015, SGS, ROHS
Payment Method:	T/T, L/C, Visa
Shipping Method:	By sea, By air, By express etc
Place Of Origin	DongGuan, China
Shipping Port	ShenZhen or Hongkong China

Thermal simulation

Factory and workshop


Certificates





Sinda Thermal is a leading thermal manufacturer in China, our factory was founded in 2014, and located in Dongguan city, China, we are offering varieties of heatsinks and other precious metal parts. Our plant possesses 30 sets advanced and high precious CNC machines and stamping machines, also we have many testing and experiment instruments and professional engineering team, so our company can manufacture and provide high quality products with high precision and excellent thermal performance. Sinda Thermal is devoted to a range of heat sinks which are widely used in new power supply, New energy vehicles, Telecommunications, Servers, IGBT, and Madical. All the products accord with Rohs/Reach standard, and the factory is qualified by ISO9001 and ISO14001. Our company has been a partner with many customers for good quality, excellent service and competitive price. Sinda Thermal is a great heat sink manufacturer for the global customers .


FAQ
1. Q: Are you a trading company or manufacturer?
    A: We are a leading heat sink manufacturer, our factory has been founded over 8 years, we are professional and experienced.

2. Q: Can you provide OEM/ODM service?
    A: Yes, OEM/ODM are available.

3. Q: Do you have MOQ limit?
    A: No, we don't set up MOQ, prototype samples are available.

4. Q: What's the lead time of the production?
    A: For prototype samples, the lead time is 1-2 weeks, for mass production, the lead time is 4-6 weeks.

5. Q: Can I visit your factory?
    A: Yes, Welcome to Sinda Thermal.

Our CPU Cooler for Intel LGA 115X/1366/2011/2066/AMD Series is a new product with the advantages of energy saving, environmental protection and economy, which is in the leading level and has been well received in the market once it is launched. The company regards R&D and innovation as the lifeline of enterprise development, and has established strategic partnerships with many universities and formed a professional technical innovation team. We adhere to the concept of product leadership to achieve double improvement of product quality and technology content.

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