CPU Porous Copper Heatsink

Our company has successfully developed a variety of high-tech Aluminum Heatsink Extrusions, CNC Part, Stamping Sheet Metal Parts, which are widely used in many fields. Through the talent selection mechanism, we stimulate the subjective initiative of our employees and let the outstanding talents stand out. We have been ready to share our knowledge of advertising and marketing worldwide and recommend you suitable products and solutions at most competitive price ranges.

Product Description:

Copper Vapor Chamber sink operate like heat pipes, using evaporation and condensation of a fluid sealed under vacuum within a metallic envelope to transport heat. When heat pipes assembly cannot offer enough design flexibility or heat spreading for your solution, vapor chamber sink are the ideal next step. Typical copper-water sintered powdered wick provides high-heat flux heat dissipation, with some configurations reaching over 300 W/cm2.

Customers can improve the thermal performance of their Heat Spreading Assembly up to 30% when compared to typical aluminum or copper base spreaders. Making the switch to a Heat Spreading Vapor Chamber sink

includes all the benefits of added thermal performance, freeze/thaw resilience, and ability to withstand military shock and vibration standards without sacrificing the reliability of the assembly.

Vapor Chamber Structure:

Prototype and Qualification Development Process:

• Prototype Fabrication

– Machining

– Vapor Chamber Fabrication

– Epoxy, Soldering, & Brazing

– Custom Integration and Assembly

• Prototype Testing

– 100% Thermal Validation Testing

– Air Flow Measurement and Analysis

– Wind Tunnels - Controlled Volumetric Airflow

– Data Collection & Reporting (Pressure, Temperature, Flow)

• Qualification Testing

– Thermal Cycling & Thermal Shock

– Shock & Vibration Testing

– Packaging Drop Testing

Fetures & Details:

Why Chose Copper Vapour Chamber Heatsink:

• More uniform heat spreading for cooler device temperatures.

• Vapor chambers may also be inserted into pockets with an extruded or cast heat sink base by soldering or thermal epoxy.

• Reduce thermal solution complexity by using one vapor chamber as opposed to multiple heat pipes with complex bent geometries.

• Fins such as Zipper Fin or Folded Fin may be mounted directly to vapor chambers by soldering.

• Higher through conductivity than graphite for thicker applications.

• Successfully thermally cycled from -40°C to +85°C.

The company adheres to the concept of "Integrity•Innovation•Development", pursues technological and management innovation, and is committed to providing high-quality products and services to fully meet the needs of customers and the market. We sincerely welcome new and old customers to join hands in creating CPU Porous Copper Heatsink national brand! We are specialized manufacturer and exporter in China. We have large-scale production plants and production lines of independent production equipment, and have strong technical capacity through continuous efforts.

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