Heat Exchanger (HCZA-260-000-100)

The quality of our Liquid Cooling, Extruded Aluminum LED Heatsink, AMD CPU Back Plate allows users to rest assured, the reasonable price makes users gratified and the after-sales service makes them feel at ease. We serve every customer with integrity and heart. We advocate common development with customers and create brilliance together. We fully understand, identify and respect the laws and regulations of the country where the company operates, and build the company's development on the basis of correct ethics and values. We attach importance to product development and technological innovation, digest and absorb the latest technology at home and abroad, enhance the core competitiveness of the enterprise, make profits while achieving sustainable development of the enterprise and create value for society for the benefit of society. Our staff are united, experienced and creative, pursuing individuality, pragmatic innovation and sincere cooperation with customers.

What is LAAC:

LAAC means Liquid Assist Air Cooling, In LAAC, liquid (typically a PG-Water) is pumped in a closed loop through liquid cold plates and a large radiator/heat exchanger. The requirement for liquid cooling at the CPU is growing due to TDP increases, T-case reductions, system density trends, and other system component power trends (e.g. accelerators, memory, and storage).

In some systems, liquid cooling loops cannot be utilized directly and requires the loop exchanges the heat directly to the air stream. In these cases, the Liquid Assisted Air Cooling (LAAC) is used to remove high amounts of power from the chips while rejecting the heat immediately into the air stream. This liquid assisted cooling offers customers the ability to cool the latest chips available in the market.

Advantages:

Liquid Assist Air Cooling another alternative thermal solution of liquid cooling, and it has many advantages combines both air cooling and liquid cooling:

1. High efficiency thermal conductivity, can support up to 300-500W per CPU

2. High reliability, no leakage risk with mature and stable process

3. Low power consumption, usually less than 10W

4. Low noise when working

5. Lighter than liquid cooling plate

6. Cost effective

Applications:

Computer Case, Heat Exchanger, Radiator, Condencer, Oil cooler, etc.

Product Features:

Packaging & Delivery:

Packaging Details: High performance cooling systems usually packed in wooden box, carton, or as per request.

Shipping Port: HongKong or ShenZhen, China

Lead Time: Sample lead time will takes about 30 days, and another 3-5 days transportation time by express air shipment.

Certifications:

In the future, we will continue our efforts to dedicate quality and affordable Heat Exchanger (HCZA-260-000-100) to meet the requirements of our customers. We always adhere to the cooperation concept of 'old friends can't forget, faith can't forget', thank leaders at all levels and new and old customers who have supported the development of our company for many years, and welcome friends from all over the world. Our company will continue to shoulder the mission of creating value for users, saving resources for society and improving the environment for human beings.

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