Swal-B014 Stacked Cooling Copper Extrusions Module Bonded Server CPU Heatsink

We uphold the spirit of 'integrity, responsibility, detail, and innovation', follow the latest development trend of CPU Fan Cooler Sink, Copper CPU Heatsink, Passive Liquild Cooling, and continuously improve the company's service level and product quality with outstanding talents, advanced technology and scientific management. We continue to improve the reliability and environmental sustainability of our products and services, protect the rights of our employees, and meet their development needs. Through these years of efforts, our company has established a corporate image of "being honest and doing things in a down-to-earth manner" in the industry. We care and treat our employees well, advocate the complementarity and inclusiveness of multiple cultures, and share the fruits of development. We make full use of the resources of the two domestic and foreign markets and actively carry out cooperation in resource development.

Product Overview:

  Since copper material has very good thermal conductivity, by adding copper material in heatsink design will provide an impressive thermal solution for high TDP system application. Our copper CPU heatsink allows customer customize any cooper material used on different heatsink components.

Sinda Thermal engineer is experienced in developing effective CPU heatsink ranges across a wide variety of applications and all industries. And our manufacturing techniques across a wide array of materials and fluids enables us to produce an optimized and reliable CPU heatsink for your system.

  Copper zipper fin heat pipe heat sink is composed of copper stamped zipper fin, copper plate and heat pipes. Copper stamped zipper fin stack is a critical component due to it has great heat dissipation performance. A stamped zipper fin stack is manufactured by using a stamping process to punch the copper sheets into designed shape from a tooling die. The fin stack are manufactured to create interlocking fins by stamping process, the copper zipper fin can be manufactured with a range of geometrics and thickness. The stamping fin technique provides high production efficiency, high aspect ratio, lightweight, and good thermal performance. Also it offers low Non recurring engineering charge, so the prototype cost can be minimal.Heat pipe is a very high effective thermal device, it's a two phase thermal component which transport the heat from the heat source to the copper fins rapidly to avoid the electronic components overheating. This heatsink is designed for high power electronic devices such as CPU, IGBT, Inverter,etc. 
  Sinda Thermal offers varieties of CPU heat sink and coolers for many Intel and AMD CPU types such as LGA4677, LGA4189, LGA4677,LGA1700,LGA1200/115X, LGA3647,AMD SP3, AMD SP5,etc.

Quick Details:

Product Name:	Copper CPU Heatsink
Material:	Aluminum + copper + stainless steel + others
Power:	100W-350W
Air Flow Rate	10CFM-40CFM
Product Size:	Standard1U, 2U or Customized
Platform	Intel, AMD, or Customized
Sample Time:	10 DAYS
Product Components	Fin, Base, HeatPipe, Thermal grease, Attachment Hardware, etc
Surface Treatment	Nickel Plated, Anodizing, Painting, etc
Certification:	GB/T19001-2016, ISO9001:2015, SGS, ROHS
Application	Server CPU, Desktop Computer, PC, Mainboard, and other customized filed

Varieties of heat sink

Thermal simulation

Factory and workshop


Certificates

Why Choose US?

1. Fast respond and professional service.

2. Cost effective and competitive price benefits for customer.

3. Factory stable capacity and quality guaranteed.

4. Flexible customization solution and trade mode for different customer.

5. Engineering and design support for small companies and start-ups.

FAQ:

Q: What information need to provided by the customer before quotation?

A: Your drawing spec, system specification request, or you can also send us the sample, then we can make the drawing for you.

Q: What is your lead time?

A: It depends on the order quantity: Usually we can ship within 7-20 days for small quantity, and about 30 days for large quantity.

Q: What is your payment term?

A: T/T in advance, for long-term business, this can be negotiated.

Q: How do you control your product quality?

A: We do all the inspection in raw material incoming process, IPQC spot check during production, 100% thermal test and cosmetic appearance check, OQC proceed shipment sampling inspection before shipping.

Q: What if I receive bad samples?

A: Please feed back to our service team, we will analyze the cause and rebuild the new sample for you ASAP.

We firmly believe that people's character creates the cause and the high-quality Swal-B014 Stacked Cooling Copper Extrusions Module Bonded Server CPU Heatsink open up the market. We continue to integrate the organic growth of our company into the demand for new materials for environmental protection, and continue to contribute to environmental protection. Over the years, our company has been adhering to the development concept and spirit of "focus on customers, focus on the market, focus on quality, focus on management, focus on talent".

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