• 01

    Oct, 2021

    Thermal conductive carbon fiber material

    Description: Thermal conductive carbon fiber is a kind of high thermal conductive carbon fiber material developed for thermal design. The thermal conductivity of this carbon fiber in the fiber directi

  • 01

    Oct, 2021

    How to choose a computer CPU heatsink

    With the coming of Summer , and the problem of computer heatstroke due to high temperature has also come. For some users, the host has been cleaned, silicone grease replaced and fan installed before,

  • 30

    Sep, 2021

    Thermal PAD application in LED

    Most of the LED products are used in closed environment. Temperature control determines the service life of products. Therefore, the selection of heat dissipation scheme and heat dissipation materials

  • 30

    Sep, 2021

    What is thermal resistance

    In the thermal industry, thermal conductivity is an important parameter reflecting the thermal conductivity of materials. However, in practical application, it is often not enough to evaluate the appl

  • 29

    Sep, 2021

    Heat pipe-a must-know LED cooling technology

    Car owners in the market demand safe light patterns, fast signal switching, high-brightness lighting effects, and high cost performance. In the design of LED car lights, cooling solution is the core p

  • 29

    Sep, 2021

    Talking about the heat creation and heat dissipation of LED

    In recent years, LED technology has been hailed as the next generation of lighting technology. With the increase of LED power supplies, cooling issues have attracted more and more attention. Researche

  • 29

    Sep, 2021

    Research on radiating and cooling technology of equipment in Telecom

    With the development of electronic equipment, high-performance computers have become increasingly popular, and the scale of Telecom equipment has also expanded. Faced with the thermal solutions requir

  • 29

    Sep, 2021

    Research on thermal design and thermal analysis of Telecom equipment

    In order to meet the requirements of high forwarding rate and fast computing and processing capabilities, chips with high packaging density are widely used in core backbone network communication equip

  • 28

    Sep, 2021

    How Does head mounted AR/VR equipment release heat

    Recently, a patent announcement showed that Apple's headset AR device will guide heat away from the wearer's head through the air deflector to realize the automatic heat dissipation of the hea

  • 28

    Sep, 2021

    Three skills of PCB thermal design

    Overheating of PCB ususally leads to partial failure or even complete failure of equipment. Thermal failure means that we need to redesign PCB. How to ensure that appropriate thermal management techno

  • 28

    Sep, 2021

    5G Base Station Liquid Cooling

    1. What is 5G? As the fifth generation mobile communication system, 5G technology has the main advantages of large transmission bandwidth and low delay: the maximum bandwidth is up to 10Gbit / s, and

  • 28

    Sep, 2021

    FPGAvs.CPU&GPU

    Medical equipment used in CPU or GPU product program is also often found not see why FPGA has such remarkable results, even with alternative CPU and GPU "magic"? In fact, CPU and GPU are the

First 135 136 137 138 139 140 141 Last 138/144