Knowledge

Many thermal engineers are very often confused when designing a thermal heatsink for the electric product, The weights, cost, performance , size limitations are all need to be balance in the whole sys

CPU heatsink thermal design has existed since the earliest desktop computer period. At the beginning, natural heat dissipation was adopted, and gradually transferred to forced air cooling. Now, liquid

The development and utilization of new technologies have accelerated the process of excessive exploitation of natural resources. The excessive utilization of natural resources has worsened environment

The first step in the thermal design and development process is to confirm which cooling method the product needs to use, in order to reserve corresponding design space in the early stage of the produ

With the emergence and rapid development of the fifth generation mobile communication technology (5G technology), electronic products, especially smartphones, tablets, and other products, are increasi

Recently, the US Patent and Trademark Office released a new patent application for Tesla called "Energy Storage Cell", which was filed on September 21, 2021 and published on October 26, 2023

Like any powerful PC hardware, CPUs generate heat during operation and require proper cooling to achieve optimal performance. As Mark Gallina, Intel's thermal and mechanical architect, explains, t

In data centers and large high-performance computing environments, server cooling is crucial for maintaining system stability and efficiency. With the improvement of processor speed and the increasing

A radiator is a collective term for a series of devices used to conduct and release heat. Modern life cannot do without it, from small phones and smartwatches to large cars and airplanes. At present,

Due to the rapid increase in demand for AI computing power, the performance and power consumption of AI chips have significantly improved simultaneously. The upper limit of power consumption for air-c

One of the main factors restricting the development of high computing power chips is their heat dissipation capability. The issue of chip heat dissipation has always plagued the industry. A chip the s

Compared with other power supplies, the system heat dissipation of the charging pile is much larger, and the requirements for the thermal design of the system are extremely strict. The power range of