Intel LGA 1700 Vapor Chamber Heat Sink

Aluminum zipper fin stack

Aluminum zipper fin stack is manufactured by stamping the aluminum sheet to form a designed shape, and interlock with each other to be the fin stack, then it will be nickel plated so it can be soldered with vapor chamber. Aluminum is the most common material for the fins as it has good heat dissipation performance, and it has lightweight, cost effective, etc. benefits. Sinda Thermal offers pre-tooled zipper fin design which has high aspect ratio fin profile, taller and thinner fin and denser fin pitch to provide more surface area and improve the heat dissipation performance.

Vapor chamber

Vapor chamber utilizes vapor and liquid two phase change to spread and transport the heat, it's very similar with heat pipe, this vapor chamber is defusion bonded by a upper plate and a bottom plate to form a cavity, the upper plate and bottom plate are made of C1020 material as this type of copper has better thermal conductivity and steability.  Like heat pipe, the vapor chamber also has wick structure to offer capillary force, the working fuild inside the cavity is typically deionized water. Vapor chamber can spread the heat very quickly, so the temperature in the surface of vapor chamber is quite uniform, so the heat can be removed from heat source more quickly and transported to aluminum zipper fins faster. Vapor chamber heat sink is widely used in high power electronic devices.

Soldering process

This heat sink module is produced by soldering the aluminum zipper fin stack and vapor chamber together with SN42BI58 solder paste, the solder paste also has good thermal conductivity, and connect the aluminum zipper fin stack and vapor chamber tightly with great joint, which significantly decreases the thermal resistance, the soldering process can tremendously improve the heat conduction and heat dissipation performance, it's a critical process for high power heat sink module.