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Micro Stamping Sink
Compared with traditional heatsink, micro stamping sink has smaller size, simpler structure for lower performance required. Usually, it contains a stamping base thinner than 5mm, zipper fin, or...
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Micro Standard Stamping Cooling Heasink
Product Description: Compared with traditional heatsink, micro stamping sink has smaller size,simpler structure for lower performance required. Usually, it contains a stamping base thinner than...
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Aluminum Folded Fin Soldering Heat Sink
Type:Folded fin soldering heat sink;
Process:Soldering;
Components:Aluminum folded fins,aluminum base,heat pipes;
Application:High power applications. -
Aluminum Zipper Fin Soldering Heat Sink
Type:Soldering heat sink;
Material:aluminum zipper fins, aluminum base, heat pipes;
Process:Soldering. -
Intel 2U Standard Heatsink
This heatsink design is optimized for Intel® Xeon® Scalable Processors thermal solutions , it contains aluminum die casting base, aluminum stamping zipper fin , copper block, and 4 heat pipes to...
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AMD 1U Standard Heatsink
This CPU heat sink is designed for AMD 1U servers series processors. The heat sink has been fully tested and validated by Sinda Thermal to ensure the best quality and cooling performance before...
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High Speed Stamping Sink
High Speed Stamping Sinks are made from a piece of metal being stamped out in a press
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Micro Thin Stamping Cooling Heatsink
Micro thin stamping cooling heatsink is a product specializing in low-power device cooling applications.
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Stamping aluminum fin heat Sink with plate
Stamping fin heatSinks with plate are an ideal air cooled solution for high power forced convection applications for mass production.usually it contains some heat pipes for rapid heat transferring.
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Copper Stamping Sink
Copper stamping sink is an assembly of a base and a stamped fin which are soldered ,brazed or epoxied together. Copper stamping sink has good thermal performance due to it allows high-density fins...
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Stamping Heat Sink
Stamping heat sink is a cost-effective solution, which can increase the surface area to increase the heat transfer of plate products. These radiators are formed by a progressive stamping process...
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AMD CPU Back Plate
For most of the applications, the motherboard CPU socket small backplane (all motherboards) and the radiator fan backplane (screw fixed heat dissipation) share the design.












