3% Aff Foam Concentrate for Fire Fighting Use

We will continue to innovate and change, keep up with the development trend of international Aluminum Extrusion CNC Sink, CNC Cooler Sink, Copper Stamping Sink, and continuously optimize our product structure. We take the product quality as the guide of behavior, measure the contribution and success, establish a rigorous and pragmatic work style, be a real person and do things steadfastly. Facing the fierce competition, our company is market-oriented, adhering to the business tenet of honesty and mutual benefit, innovative technology, creating fine products, cost reduction and professional service, actively seeking harmonious, sustainable and rapid development and a win-win situation with our customers.

Vapour Chamber Liquid Cooling is technically similar to heatpipe in working principle, but still have some difference in thermal conduction mode.

The heatpipe is one phase thermal solution while Vapour Chamber Liquid cooling is two phase thermal solution, so the Vapour Chamber efficiency is higher.

Vapour Chamber can be integrated with either aluminum or copper heatsinks, this combination makes a new micro liquid cooling system.

The simplest method is to solder a vapor chamber to the base of an extruded heatsink. A more thermally efficient method is to solder a stack of stamped fins directly to the surface of a vapor chamber. To improve the dimensional integrity, these fins are often interconnected by locking tabs called zipper fins.

Benefits & Advantages:

1. Low thermal resistance, Rca can lower to 0.05℃/W under 300W power input with 30mm*30mm heat source size.

2. Flexible design for any size and shape with different applications required.

3. Increase more thermal performance in limit designed space.

4. Maintain Devices cooler by alleviating spreading resistance.

Specifications:

With the development of technology and manufacturing process improved, vapour chamber liquid cooling is now more and more used in different areas, such as, gaming device, CPU, GPU, notebook, smart phone, telecom device, lightning applications.

Below specifications are just for technical reference only, please contact Sinda Thermal engineer for your customized design.

Application	Power	Size L x W (mm)	Thickness (mm)	Material
Gaming console	150 - 250W	150 x 150	3 – 5	Cu
Telecom Base Station	50 - 100W	100 x 100	2 – 4	Cu/Cu alloy
Graphics Card	200 - 350W	220 x 90	2 – 4	Cu/Ti
Server	200 - 400W	80 x 150	3 – 4	Cu
Inverter (IGBT)	500 - 2000W	450 x 450	3 – 8	Cu
Laptop	15-25W	220 x 60	0.5	Cu alloy
Mobile Phone	5W	80 x 50	0.3 - 0.4	Cu alloy
Mobile Phone	5W	80 x 50	0.4	Stainless Steel

Applications:

CPU & GPU

Latop & Smart Phone:

Lightning:

Vapour Chamber Process Review:

FAQ:

Q: What is the expected tooling cost for a new design.

A: The tooling cost is dependent on product size and downstream additions of components to the assembly.

Q: What is the lead-time?

A: Usually, 2 weeks design, 4 weeks proto, 8 weeks tooling.

Q: What test will be included before shipping?

A: Thermal Cycling & Thermal Shock, Shock & Vibration Testing, Packaging Drop Testing, etc, according to customers’ requirement.

As a way to provide you advantage and enlarge our organization, we even have inspectors in QC Crew and guarantee you our greatest assistance and product or service for 3% Aff Foam Concentrate for Fire Fighting Use. While developing ourselves, we also earnestly fulfill our social responsibilities and adhere to the green development concept of environmental protection, cleanliness and recycling. We have formulated and effectively implemented a competitive strategy suitable for our company, which has promoted our continuous, rapid and coordinated development.

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