Afff Fire Fighting Foam System 6% Foam Concentrate

We adhere to the business philosophy of prudence, prudence, and responsibility, and manufacture each Round Heat Sink Extrusion, Stamping Sheet Metal Parts, Extruded Heat Sink with a rigorous attitude. Under the leadership of the company team, we have provided powerful technical guarantees for different consumers. We insist on self-criticism, success comes from suffering and career starts from being a person. We strive to create a healthy and harmonious corporate cultural atmosphere and enhance our corporate image comprehensively. While asking customers to talk about credit, we emphasize that we must first talk about credit and ensure that every promise to customers and society is fulfilled.

Vapour Chamber Liquid Cooling is technically similar to heatpipe in working principle, but still have some difference in thermal conduction mode.

The heatpipe is one phase thermal solution while Vapour Chamber Liquid cooling is two phase thermal solution, so the Vapour Chamber efficiency is higher.

Vapour Chamber can be integrated with either aluminum or copper heatsinks, this combination makes a new micro liquid cooling system.

The simplest method is to solder a vapor chamber to the base of an extruded heatsink. A more thermally efficient method is to solder a stack of stamped fins directly to the surface of a vapor chamber. To improve the dimensional integrity, these fins are often interconnected by locking tabs called zipper fins.

Benefits & Advantages:

1. Low thermal resistance, Rca can lower to 0.05℃/W under 300W power input with 30mm*30mm heat source size.

2. Flexible design for any size and shape with different applications required.

3. Increase more thermal performance in limit designed space.

4. Maintain Devices cooler by alleviating spreading resistance.

Specifications:

With the development of technology and manufacturing process improved, vapour chamber liquid cooling is now more and more used in different areas, such as, gaming device, CPU, GPU, notebook, smart phone, telecom device, lightning applications.

Below specifications are just for technical reference only, please contact Sinda Thermal engineer for your customized design.

Application	Power	Size L x W (mm)	Thickness (mm)	Material
Gaming console	150 - 250W	150 x 150	3 – 5	Cu
Telecom Base Station	50 - 100W	100 x 100	2 – 4	Cu/Cu alloy
Graphics Card	200 - 350W	220 x 90	2 – 4	Cu/Ti
Server	200 - 400W	80 x 150	3 – 4	Cu
Inverter (IGBT)	500 - 2000W	450 x 450	3 – 8	Cu
Laptop	15-25W	220 x 60	0.5	Cu alloy
Mobile Phone	5W	80 x 50	0.3 - 0.4	Cu alloy
Mobile Phone	5W	80 x 50	0.4	Stainless Steel

Applications:

CPU & GPU

Latop & Smart Phone:

Lightning:

Vapour Chamber Process Review:

FAQ:

Q: What is the expected tooling cost for a new design.

A: The tooling cost is dependent on product size and downstream additions of components to the assembly.

Q: What is the lead-time?

A: Usually, 2 weeks design, 4 weeks proto, 8 weeks tooling.

Q: What test will be included before shipping?

A: Thermal Cycling & Thermal Shock, Shock & Vibration Testing, Packaging Drop Testing, etc, according to customers’ requirement.

Absolute attention to Afff Fire Fighting Foam System 6% Foam Concentrate quality and after-sales service is the foundation of our establishment and the basic means to determine perpetual operation. We will actively explore the market to ensure the sustainable, stable and healthy development of our company and constantly explore a more brilliant future. Strive is we are not satisfied with the status quo, the pursuit of higher goals of the inherent spiritual requirements.

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